Des:SMBB technology reduce the distance between busbars and finger grid line which is benefit to power increase.，Minimized micro-cracks with innovative non-destructive cutting technology，Higher string power feature e ectively reduces BOS and LCOE，Lower temperature coe cient (-0.28%)And lower operating temperatures lead to more power generation.
Des:Better light trapping and current collection to improve module power output and reliability. better anti-PID performance, low power attenuation, high power outpu .The bifacial layout brings greater power, High bifaciality and excellent power temperature coefficientachieves high energy yield.
